Invention Grant
- Patent Title: Downward-facing optical component module
- Patent Title (中): 向下的光学部件模块
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Application No.: US12433751Application Date: 2009-04-30
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Publication No.: US08804368B2Publication Date: 2014-08-12
- Inventor: Yoshinari Matsuda , Ramon Osuma , Ivan Cazarez , Rogelio Ruiz
- Applicant: Yoshinari Matsuda , Ramon Osuma , Ivan Cazarez , Rogelio Ruiz
- Applicant Address: JP Tokyo US NJ Park Ridge
- Assignee: Sony Corporation,Sony Electronics Inc.
- Current Assignee: Sony Corporation,Sony Electronics Inc.
- Current Assignee Address: JP Tokyo US NJ Park Ridge
- Agent John P. O'Banion
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/14

Abstract:
A motherboard for an electronic device comprising a main printed circuit board (PCB) with a through-hole extending between the upper component surface and the lower surface. The motherboard includes a carrier PCB having a top surface and a bottom surface, and at least one component, e.g. an optical device, sensor, or the like, coupled to the top surface. The carrier PCB is mounted in an in an inverted orientation with respect to the main PCB such that the top surface of the carrier PCB faces the upper component surface of the main PCB. The carrier PCB is aligned with the main PCB such that the component is substantially aligned with the through hole of the main PCB and is visible from the lower surface of the PCB.
Public/Granted literature
- US20100277883A1 DOWNWARD-FACING OPTICAL COMPONENT MODULE Public/Granted day:2010-11-04
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