Invention Grant
- Patent Title: Methods and apparatus related to a modular switch architecture
- Patent Title (中): 与模块化交换架构相关的方法和设备
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Application No.: US12345502Application Date: 2008-12-29
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Publication No.: US08804711B2Publication Date: 2014-08-12
- Inventor: Gunes Aybay , Jaya Bandyopadhyay , Jean-Marc Frailong , Pradeep Sindhu , Philip A. Thomas , Anjan Venkatramani
- Applicant: Gunes Aybay , Jaya Bandyopadhyay , Jean-Marc Frailong , Pradeep Sindhu , Philip A. Thomas , Anjan Venkatramani
- Applicant Address: US CA Sunnyvale
- Assignee: Juniper Networks, Inc.
- Current Assignee: Juniper Networks, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Cooley LLP
- Main IPC: H04L12/58
- IPC: H04L12/58 ; H04L12/56

Abstract:
In some embodiments, an apparatus includes a first housing, a second housing and at least one cable. The first housing includes a first interface card of a switch fabric. The second housing includes a second interface card of the switch fabric and a third interface card of the switch fabric. The second interface card of the switch fabric is operatively and physically coupled to the third interface card of the switch fabric via a midplane. The second interface card defines a plane that is nonparallel to the a plane defined by the third interface card and a plane defined by the midplane. The plane defined by the third interface card is nonparallel to the plane defined by the second interface card and the plane defined by the midplane. The cable is configured to operatively couple the first interface card to the second interface card.
Public/Granted literature
- US20100165984A1 METHODS AND APPARATUS RELATED TO A MODULAR SWITCH ARCHITECTURE Public/Granted day:2010-07-01
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