Invention Grant
- Patent Title: Integrated circuit package connected to a data transmission medium
- Patent Title (中): 集成电路封装连接到数据传输介质
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Application No.: US13312327Application Date: 2011-12-06
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Publication No.: US08805132B2Publication Date: 2014-08-12
- Inventor: Harry Barowski , Thomas Brunschwiler , Roger F. Dangel , Hubert Harrer , Andreas Huber , Norbert M. Meier , Bruno Michel , Tim Niggemeier , Stephan Paredes , Jochen Supper , Jonas R. Weiss
- Applicant: Harry Barowski , Thomas Brunschwiler , Roger F. Dangel , Hubert Harrer , Andreas Huber , Norbert M. Meier , Bruno Michel , Tim Niggemeier , Stephan Paredes , Jochen Supper , Jonas R. Weiss
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Priority: EP10194096 20101208
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/26 ; H01L23/02 ; H01L23/48 ; H01L23/52 ; H01L21/00 ; G02B6/43 ; H01L25/065 ; H01L23/522
Abstract:
An integrated circuit coupling device includes an integrated circuit package with N integrated circuit layers (L1-LN) arranged as a 3D stack; and a data transmission medium with n data transmission layers (l1-ln), wherein n≧1 and N≧2, and wherein the N integrated circuit layers are electrically connectable to the n data transmission layers.
Public/Granted literature
- US20120148187A1 INTEGRATED CIRCUIT PACKAGE CONNECTED TO A DATA TRANSMISSION MEDIUM Public/Granted day:2012-06-14
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