Invention Grant
- Patent Title: Implantable lead and medical device using the same
- Patent Title (中): 可植入引线和使用其的医疗器械
-
Application No.: US13749653Application Date: 2013-01-24
-
Publication No.: US08805536B2Publication Date: 2014-08-12
- Inventor: Lu-Ming Li , Chang-Qing Jiang , Hong-Wei Hao
- Applicant: Tsinghua University
- Applicant Address: CN Beijing
- Assignee: Tsinghua University
- Current Assignee: Tsinghua University
- Current Assignee Address: CN Beijing
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Main IPC: A61N1/00
- IPC: A61N1/00

Abstract:
An implantable lead includes a pipe, a flexible conductive layer, at least one connector, at least one contactor and at least one wire. The pipe includes a first end portion, a second end portion opposite to the first end portion, and a middle portion connecting the first end portion and the second end portion. The flexible conductive layer is located on the middle portion of the pipe. The at least one connector is located on the first end portion of the pipe. The at least one contactor is located on the second end portion of the pipe. The at least one wire is located in the pipe and electrically connects the at least one connector and the at least one contactor. A medical device using the implantable lead is also provided.
Public/Granted literature
- US20140074200A1 IMPLANTABLE LEAD AND MEDICAL DEVICE USING THE SAME Public/Granted day:2014-03-13
Information query