Invention Grant
- Patent Title: Liquid jet head and liquid jet apparatus
- Patent Title (中): 液体喷头和液体喷射装置
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Application No.: US13625925Application Date: 2012-09-25
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Publication No.: US08807707B2Publication Date: 2014-08-19
- Inventor: Toshiaki Watanabe
- Applicant: Toshiaki Watanabe
- Applicant Address: JP
- Assignee: SII Printek Inc.
- Current Assignee: SII Printek Inc.
- Current Assignee Address: JP
- Agency: Adams & Wilks
- Priority: JP2011-211217 20110927
- Main IPC: B41J2/14
- IPC: B41J2/14 ; H05K1/14

Abstract:
Provided is a liquid jet head in which a region of the liquid jet head on a side opposite to a liquid ejection side thereof is thinned to enhance efficiency of use of the region. A liquid jet head (1) includes an ejecting portion (3) for ejecting liquid in which first and second head chips (2a and 2b) are stacked, a circuit board (4) for supplying a drive signal for driving the ejecting portion (3), a first flexible printed circuit board (5a) for electrically connecting the first head chip (2a) and the circuit board (4) to each other, and a second flexible printed circuit board (5b) for electrically connecting the second head chip (2b) and the circuit board (4) to each other. The circuit board (4) and each of the first and second flexible printed circuit boards (5a and 5b) are electrically connected to each other on one surface (S) of the circuit board (4).
Public/Granted literature
- US20130083128A1 LIQUID JET HEAD AND LIQUID JET APPARATUS Public/Granted day:2013-04-04
Information query
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