Invention Grant
US08808011B2 Contact and bonding structure of the contact 有权
触点接触和接合结构

Contact and bonding structure of the contact
Abstract:
A contact capable of electrically connecting an electrically conductive portion provided on a plate-like member with an electrically conductive member different from the plate-like member. The contact includes a main body; a movable portion held by the main body so as to be reciprocal in directions of increasing and decreasing of a projecting amount thereof outwardly of the main body; and a biasing mechanism that biases the movable portion in such a direction that the projecting amount of the movable portion increases. The main body includes a tubular portion, a solder inflow suppressing portion, and a soldering portion.
Public/Granted literature
Information query
Patent Agency Ranking
0/0