Invention Grant
- Patent Title: Contact and bonding structure of the contact
- Patent Title (中): 触点接触和接合结构
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Application No.: US13520246Application Date: 2011-11-04
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Publication No.: US08808011B2Publication Date: 2014-08-19
- Inventor: Hiroki Kitano , Hideo Yumi , Tatsuya Nakamura
- Applicant: Hiroki Kitano , Hideo Yumi , Tatsuya Nakamura
- Applicant Address: JP Aichi
- Assignee: Kitagawa Industries Co., Ltd.
- Current Assignee: Kitagawa Industries Co., Ltd.
- Current Assignee Address: JP Aichi
- Agency: Davis & Bujold, PLLC
- Agent Michael J. Bujold
- Priority: JP2010-250941 20101109; JP2011-212952 20110928
- International Application: PCT/JP2011/075475 WO 20111104
- International Announcement: WO2012/063741 WO 20120518
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R13/24 ; H01R12/57 ; H01R12/58 ; H05K3/34 ; H05K1/02 ; H05K1/18

Abstract:
A contact capable of electrically connecting an electrically conductive portion provided on a plate-like member with an electrically conductive member different from the plate-like member. The contact includes a main body; a movable portion held by the main body so as to be reciprocal in directions of increasing and decreasing of a projecting amount thereof outwardly of the main body; and a biasing mechanism that biases the movable portion in such a direction that the projecting amount of the movable portion increases. The main body includes a tubular portion, a solder inflow suppressing portion, and a soldering portion.
Public/Granted literature
- US20130264098A1 CONTACT AND BONDING STRUCTURE OF THE CONTACT Public/Granted day:2013-10-10
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