Invention Grant
- Patent Title: High density connector structure for transmitting high frequency signals
- Patent Title (中): 用于传输高频信号的高密度连接器结构
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Application No.: US13761160Application Date: 2013-02-07
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Publication No.: US08808029B2Publication Date: 2014-08-19
- Inventor: Josue Castillo , James Patrick Young , Li-Sen Chen , Steven Wong , Hua-Chun Chang
- Applicant: Speed Tech Corp.
- Applicant Address: TW Taoyuan Hsien
- Assignee: Speed Tech Corp.
- Current Assignee: Speed Tech Corp.
- Current Assignee Address: TW Taoyuan Hsien
- Agency: CKC & Partners Co. Ltd.
- Priority: TW101214163U 20120720
- Main IPC: H01R13/648
- IPC: H01R13/648

Abstract:
A high density connector structure for transmitting high frequency signals having a first sub-assembly, a second sub-assembly, a shield plate, and a shield shell is disclosed. The first sub-assembly has a plurality of first contacts held in a first insulator, and the second sub-assembly has a plurality of second contacts held in a second insulator. The shield plate is positioned between the first and second contacts. At least one resilient arm extends from said shield plate and contacts at least one of the first contacts of the first sub-assembly. The shield shell at least partially surrounds the periphery of the first and second sub-assemblies.
Public/Granted literature
- US20140024257A1 HIGH DENSITY CONNECTOR STRUCTURE FOR TRANSMITTING HIGH FREQUENCY SIGNALS Public/Granted day:2014-01-23
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