A polishing article with a plurality of polishing pads adapted to polish a substrate. Gimbal structures are attached to the polishing pads that permit the polishing pads to move independently along at least a pitch axis and a roll axis. Stems supported by preload flexures apply preloads through dimple structures to the polishing pads. A plurality of stand-offs provide fixed boundary conditions between the preload and the gimbal structures. Recesses allow for the preload flexures to move vertically.