Invention Grant
- Patent Title: Process for producing a liquid ejection head
- Patent Title (中): 用于制造液体喷射头的方法
-
Application No.: US13685172Application Date: 2012-11-26
-
Publication No.: US08808553B2Publication Date: 2014-08-19
- Inventor: Akio Goto
- Applicant: Canon Kabushiki Kaisha
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2012-005081 20120113
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16 ; B41J2/335 ; B44C1/22

Abstract:
A process for producing a liquid ejection head including a silicon substrate having a first surface and a second surface that is a surface on an opposite side to the first surface, an ejection energy generating element which is formed on a side of the first surface side and generates energy for ejecting a liquid, a cavity formed in the second surface and a liquid supply port which is formed in a bottom part of the cavity and communicates with the first surface, including, in the following order: (1) forming the cavity in the second surface of the silicon substrate by a first crystal anisotropic etching; (2) forming a chemical leading hollow in a slope of the cavity; (3) expanding the cavity by a second crystal anisotropic etching; and (4) forming the liquid supply port in a bottom face of the cavity by dry etching with the use of an ion.
Public/Granted literature
- US20130180944A1 PROCESS FOR PRODUCING A LIQUID EJECTION HEAD Public/Granted day:2013-07-18
Information query
IPC分类: