Invention Grant
- Patent Title: Method for manufacturing conductive adhesive containing one-dimensional conductive nanomaterial
- Patent Title (中): 制造含有一维导电纳米材料的导电胶的方法
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Application No.: US12827093Application Date: 2010-06-30
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Publication No.: US08808583B2Publication Date: 2014-08-19
- Inventor: Yi-Hsiuan Yu , Bao-Yann Lin , Ming-Hsiung Wei , Lea-Hwung Leu , Gou-Hong Yiin , Chen-Chi M Ma
- Applicant: Yi-Hsiuan Yu , Bao-Yann Lin , Ming-Hsiung Wei , Lea-Hwung Leu , Gou-Hong Yiin , Chen-Chi M Ma
- Applicant Address: TW Taoyuan County
- Assignee: Chung Shan Institute of Science and Technology Armaments Bureau, M.N.D.
- Current Assignee: Chung Shan Institute of Science and Technology Armaments Bureau, M.N.D.
- Current Assignee Address: TW Taoyuan County
- Agency: Rosenberg, Klein & Lee
- Main IPC: H01B1/22
- IPC: H01B1/22 ; H01B1/20
Abstract:
A method for manufacturing a conductive adhesive containing a one-dimensional (1D) conductive nanomaterial is revealed. The method produces a conductive adhesive by mixing the 1D conductive nanomaterial with water-based or solvent-based resin solution. The conductive adhesive has good industrial applications, not influenced by industrial adaptability and environmental adaptability. The conductive adhesive obtained also has better conductivity. Moreover, the amount of the 1D conductive nanomaterial used in the present invention is less than the amount of conductive nanoparticles used and the cost is reduced effectively.
Public/Granted literature
- US20120001130A1 METHOD FOR MANUFACTURING CONDUCTIVE ADHESIVE CONTAINING ONE-DIMENSIONAL CONDUCTIVE NANOMATERIAL Public/Granted day:2012-01-05
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