Invention Grant
- Patent Title: Methods for integrating a functional component into a microfluidic device
- Patent Title (中): 将功能组分整合到微流体装置中的方法
-
Application No.: US12012653Application Date: 2008-02-04
-
Publication No.: US08808588B1Publication Date: 2014-08-19
- Inventor: Blake Simmons , Linda Domeier , Noble Woo , Timothy Shepodd , Ronald F. Renzi
- Applicant: Blake Simmons , Linda Domeier , Noble Woo , Timothy Shepodd , Ronald F. Renzi
- Applicant Address: US NM Albuquerque
- Assignee: Sandia Corporation
- Current Assignee: Sandia Corporation
- Current Assignee Address: US NM Albuquerque
- Agency: Dorsey & Whitney LLP
- Main IPC: G01N15/06
- IPC: G01N15/06 ; G01N33/00

Abstract:
Injection molding is used to form microfluidic devices with integrated functional components. One or more functional components are placed in a mold cavity, which is then closed. Molten thermoplastic resin is injected into the mold and then cooled, thereby forming a solid substrate including the functional component(s). The solid substrate including the functional component(s) is then bonded to a second substrate, which may include microchannels or other features.
Information query