Invention Grant
- Patent Title: Copper containing algicidal compounds
- Patent Title (中): 含铜杀藻化合物
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Application No.: US12444800Application Date: 2007-10-11
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Publication No.: US08808756B2Publication Date: 2014-08-19
- Inventor: Rachael A. T. Gould , Rebecca L. Everman , Jamieson C. Keister , Kathleen K. Reynolds
- Applicant: Rachael A. T. Gould , Rebecca L. Everman , Jamieson C. Keister , Kathleen K. Reynolds
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- Agent Craig A. Deutsch
- International Application: PCT/US2007/081061 WO 20071011
- International Announcement: WO2008/045992 WO 20080417
- Main IPC: A01N59/20
- IPC: A01N59/20 ; B32B5/16 ; B32B3/26 ; A01P13/00
Abstract:
The present application is directed to a coating composition comprising a ceramic binder and inorganic copper compound particles. Generally, the inorganic copper compound particles have a median particle size of less than 5 micrometers. In some embodiments, the particles have a median particle size of greater than 1 micrometer. The inorganic copper compound particles may be non-photocatalytic. The coating may also be placed on a structural layer.
Public/Granted literature
- US20100098777A1 COPPER CONTAINING ALGICIDAL COMPOUNDS Public/Granted day:2010-04-22
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