Invention Grant
- Patent Title: Processing a wafer with a post application bake (PAB) procedure
- Patent Title (中): 使用后应用烘烤（PAB）程序处理晶片
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Application No.: US12886361Application Date: 2010-09-20
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Publication No.: US08808788B2Publication Date: 2014-08-19
- Inventor: Thomas E. Winter
- Applicant: Thomas E. Winter
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agent Manuel B. Madriaga
- Main IPC: C23C16/52
- IPC: C23C16/52 ; C23C16/44 ; C23C16/46 ; C23C16/56
Abstract:
An Exhaust Gas Analyzer (EGA) subsystem for monitoring exhaust gasses, for controlling and rapidly adjusting the processing conditions within a processing chamber in a thermal processing unit used for heating-treating wafers before and/or during Post Application Bake (PAB) procedures. The EGA subsystem can be used to control and/or optimize the heat-treating of coated wafers at different bake plate temperatures, and the EGA subsystem can provide a high wafer throughput.
Public/Granted literature
- US20120070564A1 Bake Plate Exhaust Monitor Public/Granted day:2012-03-22
Information query
IPC分类:
