Invention Grant
- Patent Title: Method for manufacturing a submillimetric electrically conductive grid coated with an overgrid
- Patent Title (中): 制造涂覆有过网格的亚毫米级导电栅格的方法
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Application No.: US13120580Application Date: 2009-09-25
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Publication No.: US08808790B2Publication Date: 2014-08-19
- Inventor: Georges Zagdoun , Bernard Nghiem , Eddy Royer
- Applicant: Georges Zagdoun , Bernard Nghiem , Eddy Royer
- Applicant Address: FR Courbevoie
- Assignee: Saint-Gobain Glass France
- Current Assignee: Saint-Gobain Glass France
- Current Assignee Address: FR Courbevoie
- Agency: Pillsbury Winthrop Shaw Pittman LLP
- Priority: FR0856448 20080925
- International Application: PCT/FR2009/051822 WO 20090925
- International Announcement: WO2010/034950 WO 20100401
- Main IPC: B05D5/12
- IPC: B05D5/12 ; H05K3/04 ; C23C14/04 ; C23C16/04 ; C23C18/06 ; B05D1/32

Abstract:
A method of manufacturing a submillimetric electroconductive grid coated with an overgrid on a substrate includes: the production of a mask having submillimetric openings by the deposition of a solution of colloidal polymeric nanoparticles that are stabilized and dispersed in a solvent, the polymeric particles having a glass transition temperature Tg and the drying of the masking layer at a temperature below the Tg until the mask, with straight edges, is obtained, the formation of the electroconductive grid by a deposition of electroconductive material, referred to as grid material, a heat treatment of the masking layer with the grid material at a temperature greater than or equal to 0.8 times Tg, thus creating a space between the edges of mask zones and the lateral edges of the grid; a deposition of a layer, referred to as an overlayer, made of a material referred to as overlayer material, on the grid and in the space between the edges of mask zones and the lateral edges of the grid; a removal of the masking layer. The invention also relates to the grid thus obtained.
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