Invention Grant
US08808791B2 Method for strengthening adhesion between dielectric layers formed adjacent to metal layers
有权
用于加强与金属层相邻形成的介电层之间的附着力的方法
- Patent Title: Method for strengthening adhesion between dielectric layers formed adjacent to metal layers
- Patent Title (中): 用于加强与金属层相邻形成的介电层之间的附着力的方法
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Application No.: US14056010Application Date: 2013-10-17
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Publication No.: US08808791B2Publication Date: 2014-08-19
- Inventor: Igor C. Ivanov , Weiguo Zhang , Artur Kolics
- Applicant: Lam Research Corporation
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Beyer Law Group LLP
- Main IPC: C23C20/02
- IPC: C23C20/02 ; C23C20/04 ; H01L21/28 ; H01L21/288

Abstract:
A method is provided which includes forming a metal layer and converting at least a portion of the metal layer to a hydrated metal oxide layer. Another method is provided which includes selectively depositing a dielectric layer upon another dielectric layer and selectively depositing a metal layer adjacent to the dielectric layer. Consequently, a microelectronic topography is formed which includes a metal feature and an adjacent dielectric portion comprising lower and upper layers of hydrophilic and hydrophobic material, respectively. A topography including a metal feature having a single layer with at least four elements lining a lower surface and sidewalls of the metal feature is also provided herein. The fluid/s used to form such a single layer may be analyzed by test equipment configured to measure the concentration of all four elements. In some cases, the composition of the fluid/s may be adjusted based upon the analysis.
Public/Granted literature
- US20140037982A1 Method for Strengthening Adhesion Between Dielectric Layers Formed Adjacent to Metal Layers Public/Granted day:2014-02-06
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