Invention Grant
- Patent Title: Coating method
- Patent Title (中): 涂布方法
-
Application No.: US13569345Application Date: 2012-08-08
-
Publication No.: US08808798B2Publication Date: 2014-08-19
- Inventor: Takahiro Kitano , Koichi Obata , Hiroichi Inada , Nobuhiro Ogata
- Applicant: Takahiro Kitano , Koichi Obata , Hiroichi Inada , Nobuhiro Ogata
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-127355 20080514
- Main IPC: B05D3/12
- IPC: B05D3/12 ; H01L21/67 ; H01L21/683 ; H01L21/027 ; G03F7/16

Abstract:
A coating method includes supplying a coating liquid from a coating nozzle onto a front side central portion of a substrate held on a substrate holding member, rotating the substrate holding member about a vertical axis to spread the coating liquid toward a peripheral portion of the substrate by a centrifugal force and thereby form a film of the coating liquid, forming a liquid film of a process liquid for preventing a contaminant derived from the coating liquid from being deposited or left on a back side peripheral portion of the substrate, and damping a vertical wobble of the peripheral portion of the substrate being rotated, by a posture regulating mechanism, while delivering a gas from delivery holes onto a back side region of the substrate on an inner side of the peripheral portion on which the liquid film is formed.
Public/Granted literature
- US20120301612A1 COATING METHOD Public/Granted day:2012-11-29
Information query