Invention Grant
US08808809B2 Method for applying hot melt adhesive powder onto a shoe or sole part
有权
将热熔粘合剂粉末施加到鞋或鞋底部分上的方法
- Patent Title: Method for applying hot melt adhesive powder onto a shoe or sole part
- Patent Title (中): 将热熔粘合剂粉末施加到鞋或鞋底部分上的方法
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Application No.: US14014143Application Date: 2013-08-29
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Publication No.: US08808809B2Publication Date: 2014-08-19
- Inventor: Jakov Makover , Bar Cochva Mardix , Yaacov Sadeh
- Applicant: Orisol Asia Ltd.
- Applicant Address: TW Chang Hwa
- Assignee: Orisol Asia Ltd.
- Current Assignee: Orisol Asia Ltd.
- Current Assignee Address: TW Chang Hwa
- Agent Banger Shia
- Main IPC: B05D1/06
- IPC: B05D1/06 ; B05D5/10 ; A43D25/20 ; A43D111/00 ; A43D117/00 ; A43D25/18 ; B29L31/50

Abstract:
A method for applying hot melt adhesive powder onto a sole or shoe part includes the steps of applying a cleaning agent, irradiating, applying a conductive liquid which has a conductivity at least 100 times higher than purified water which has a conductivity of 5.5·10−6 S/m, spraying hot melt adhesive powder; and heating. The method can save energy, reduce the working space, reduce the labor intensity and improve the working environment by continuously carrying out the spraying and the melting operation of the hot melt adhesive.
Public/Granted literature
- US20140093655A1 Method for Applying Hot Melt Adhesive Powder onto a Shoe or Sole Part Public/Granted day:2014-04-03
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