Invention Grant
- Patent Title: Carrier-attached copper foil and method for manufacturing the same
- Patent Title (中): 载体铜箔及其制造方法
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Application No.: US13277610Application Date: 2011-10-20
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Publication No.: US08808873B2Publication Date: 2014-08-19
- Inventor: Yu-Chung Chen , Yi-Ling Lo , Hung-Kun Lee , Tzu-Ping Cheng
- Applicant: Yu-Chung Chen , Yi-Ling Lo , Hung-Kun Lee , Tzu-Ping Cheng
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW99135902A 20101021; TW100101726A 20110118
- Main IPC: B32B15/01
- IPC: B32B15/01
Abstract:
In an embodiment of the invention, a method for manufacturing a carrier-attached copper foil is provided. The method includes providing a carrier foil including stainless steel, titanium, aluminum, nickel or alloy thereof with a surface oxide layer, and forming a copper foil onto the carrier foil to prepare the carrier-attached copper foil.
Public/Granted literature
- US20120097544A1 CARRIER-ATTACHED COPPER FOIL AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2012-04-26
Information query
