Invention Grant
- Patent Title: Method of forming pattern
- Patent Title (中): 形成图案的方法
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Application No.: US13402400Application Date: 2012-02-22
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Publication No.: US08808973B2Publication Date: 2014-08-19
- Inventor: Satoshi Mikoshiba , Koji Asakawa , Hiroko Nakamura , Shigeki Hattori , Atsushi Hieno , Tsukasa Azuma , Yuriko Seino , Masahiro Kanno
- Applicant: Satoshi Mikoshiba , Koji Asakawa , Hiroko Nakamura , Shigeki Hattori , Atsushi Hieno , Tsukasa Azuma , Yuriko Seino , Masahiro Kanno
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2011-037273 20110223
- Main IPC: G03F7/26
- IPC: G03F7/26

Abstract:
According to one embodiment, there is provided a method of forming a pattern including forming a polymer layer on a substrate, the polymer layer including a first and second regions, selectively irradiating either of the first and second regions with energy rays or irradiating the first and second regions with energy rays under different conditions to cause a difference in surface free energy between the first and second regions, thereafter, forming a block copolymer layer on the polymer layer, and causing microphase separation in the block copolymer layer to simultaneously form first and second microphase-separated structures on the first and second regions, respectively.
Public/Granted literature
- US20120214094A1 METHOD OF FORMING PATTERN Public/Granted day:2012-08-23
Information query
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