Invention Grant
US08808975B2 Positive resist composition for immersion exposure and pattern-forming method using the same
有权
用于浸渍曝光的正型抗蚀剂组合物和使用其的图案形成方法
- Patent Title: Positive resist composition for immersion exposure and pattern-forming method using the same
- Patent Title (中): 用于浸渍曝光的正型抗蚀剂组合物和使用其的图案形成方法
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Application No.: US12858128Application Date: 2010-08-17
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Publication No.: US08808975B2Publication Date: 2014-08-19
- Inventor: Haruki Inabe , Hiromi Kanda , Kunihiko Kodama
- Applicant: Haruki Inabe , Hiromi Kanda , Kunihiko Kodama
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2005-238734 20050819
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/029 ; G03F7/039 ; G03F7/26
Abstract:
A positive resist composition for immersion exposure comprises: (A) a resin capable of increasing its solubility in an alkali developer by an action of an acid, and (B) a compound capable of generating an acid upon irradiation with actinic ray or radiation, wherein the acid satisfies conditions of V≧230 and V/S≦0.93 taking van der Waals volume of the acid as V (Å3), and van der Waals surface area of the acid as S (Å2).
Public/Granted literature
- US20100310991A1 POSITIVE RESIST COMPOSITION FOR IMMERSION EXPOSURE AND PATTERN-FORMING METHOD USING THE SAME Public/Granted day:2010-12-09
Information query
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