Invention Grant
- Patent Title: Method of manufacturing solid-state image sensor
- Patent Title (中): 制造固态图像传感器的方法
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Application No.: US13477665Application Date: 2012-05-22
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Publication No.: US08809094B2Publication Date: 2014-08-19
- Inventor: Hideomi Kumano
- Applicant: Hideomi Kumano
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2011-133539 20110615
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L27/146

Abstract:
A method of manufacturing a solid-state image sensor, comprising preparing a semiconductor substrate including a photoelectric converter and an insulating film which includes an opening and is formed in a region above the photoelectric converter, depositing a material having a refractive index higher than the insulating film in the opening, and annealing the material deposited in the opening by irradiating the material with one of light and radiation, wherein a light waveguide which is configured to guide an incident light to the photoelectric converter is formed through the depositing and the annealing.
Public/Granted literature
- US20120322196A1 METHOD OF MANUFACTURING SOLID-STATE IMAGE SENSOR Public/Granted day:2012-12-20
Information query
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