Invention Grant
- Patent Title: Micromechanical component and method for producing a micromechanical component having a thin-layer cap
- Patent Title (中): 微机械部件和用于制造具有薄层盖的微机械部件的方法
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Application No.: US12451327Application Date: 2008-05-19
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Publication No.: US08809095B2Publication Date: 2014-08-19
- Inventor: Volker Schmitz , Axel Grosse
- Applicant: Volker Schmitz , Axel Grosse
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102007025880 20070601
- International Application: PCT/EP2008/056117 WO 20080519
- International Announcement: WO2008/145553 WO 20081204
- Main IPC: H01L27/14
- IPC: H01L27/14
Abstract:
A micromechanical component having a substrate, a micromechanical functional layer situated above the substrate, and an encapsulation layer situated above the functional layer, and a method for producing the micromechanical component are provided, the encapsulation layer having at least one trench, and a bridging of the trench by at least one electrically insulating connection link is provided.
Public/Granted literature
- US20110006444A1 MICROMECHANICAL COMPONENT AND METHOD FOR PRODUCING A MICROMECHANCAL COMPONENT HAVING A THIN-LAWYER CAP Public/Granted day:2011-01-13
Information query
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