Invention Grant
- Patent Title: Method of processing a semiconductor assembly
- Patent Title (中): 半导体组件的处理方法
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Application No.: US13523059Application Date: 2012-06-14
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Publication No.: US08809105B2Publication Date: 2014-08-19
- Inventor: Jinbo Cao , Bastiaan Arie Korevaar
- Applicant: Jinbo Cao , Bastiaan Arie Korevaar
- Applicant Address: US AZ Tempe
- Assignee: First Solar, Inc.
- Current Assignee: First Solar, Inc.
- Current Assignee Address: US AZ Tempe
- Agency: MacMillan, Sobanski & Todd, LLC
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method for processing a semiconductor assembly is presented. The method includes thermally processing a semiconductor assembly in a non-oxidizing atmosphere at a pressure greater than about 10 Torr. The semiconductor assembly includes a semiconductor layer disposed on a support, and the semiconductor layer includes cadmium and sulfur.
Public/Granted literature
- US20130337600A1 METHOD OF PROCESSING A SEMICONDUCTOR ASSEMBLY Public/Granted day:2013-12-19
Information query
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