Invention Grant
- Patent Title: Method for making Schottky barrier diode
- Patent Title (中): 制造肖特基势垒二极管的方法
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Application No.: US13337235Application Date: 2011-12-26
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Publication No.: US08809107B2Publication Date: 2014-08-19
- Inventor: Chun-Hua Hu , Chang-Hong Liu , Shou-Shan Fan
- Applicant: Chun-Hua Hu , Chang-Hong Liu , Shou-Shan Fan
- Applicant Address: CN Beijing TW New Taipei
- Assignee: Tsinghua University,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Tsinghua University,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Beijing TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201110215767 20110729
- Main IPC: H01L21/04
- IPC: H01L21/04 ; H01L51/05 ; H01L51/00

Abstract:
A method for making a Schottky barrier diode includes the following steps. A first metal layer, a second metal layer and a carbon nanotube composite material are provided. The carbon nanotube composite material is applied on the first metal layer and the second metal layer to form a semiconductor layer. The carbon nanotube composite material includes an insulated polymer and a number of carbon nanotubes dispersed in the insulated polymer. The semiconductor layer is in Schottky contact with the first metal layer and in ohmic contact with the second metal layer.
Public/Granted literature
- US20130029459A1 METHOD FOR MAKING SCHOTTKY BARRIER DIODE Public/Granted day:2013-01-31
Information query
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