Invention Grant
- Patent Title: Capping layers for metal oxynitride TFTs
- Patent Title (中): 金属氮氧化物TFT的封盖层
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Application No.: US13215013Application Date: 2011-08-22
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Publication No.: US08809132B2Publication Date: 2014-08-19
- Inventor: Yan Ye
- Applicant: Yan Ye
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/84 ; H01L29/786 ; H01L21/02

Abstract:
A capping layer may be deposited over the active channel of a thin film transistor (TFT) in order to protect the active channel from contamination. The capping layer may affect the performance of the TFT. If the capping layer contains too much hydrogen, nitrogen, or oxygen, the threshold voltage, sub threshold slope, and mobility of the TFT may be negatively impacted. By controlling the ratio of the flow rates of the nitrogen, oxygen, and hydrogen containing gases, the performance of the TFT may be optimized. Additionally, the power density, capping layer deposition pressure, and the temperature may also be controlled to optimize the TFT performance.
Public/Granted literature
- US20110306169A1 CAPPING LAYERS FOR METAL OXYNITRIDE TFTS Public/Granted day:2011-12-15
Information query
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