Invention Grant
- Patent Title: Fin-last FinFET and methods of forming same
- Patent Title (中): Fin-Fin FinFET及其形成方法
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Application No.: US13689346Application Date: 2012-11-29
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Publication No.: US08809139B2Publication Date: 2014-08-19
- Inventor: Yu-Lien Huang , Ming-Huan Tsai , Clement Hsingjen Wann
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater and Matsil, L.L.P.
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L21/8234

Abstract:
Embodiments of the present disclosure are a FinFET device, and methods of forming a FinFET device. An embodiment is a method for forming a FinFET device, the method comprising forming a semiconductor strip over a semiconductor substrate, wherein the semiconductor strip is disposed in a dielectric layer, forming a gate over the semiconductor strip and the dielectric layer, and forming a first recess and a second recess in the semiconductor strip, wherein the first recess is on an opposite side of the gate from the second recess. The method further comprises forming a source region in the first recess and a drain region in the second recess, and recessing the dielectric layer, wherein a first portion of the semiconductor strip extends above a top surface of the dielectric layer forming a semiconductor fin.
Public/Granted literature
- US20140145242A1 Fin-Last FinFET and Methods of Forming Same Public/Granted day:2014-05-29
Information query
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