Invention Grant
US08809151B2 Transistor comprising an embedded sigma shaped sequentially formed semiconductor alloy
有权
晶体管包括嵌入式西格玛顺序形成的半导体合金
- Patent Title: Transistor comprising an embedded sigma shaped sequentially formed semiconductor alloy
- Patent Title (中): 晶体管包括嵌入式西格玛顺序形成的半导体合金
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Application No.: US13232571Application Date: 2011-09-14
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Publication No.: US08809151B2Publication Date: 2014-08-19
- Inventor: Stefan Flachowsky , Stephan-Detlef Kronholz , Jan Hoentschel , Thilo Scheiper
- Applicant: Stefan Flachowsky , Stephan-Detlef Kronholz , Jan Hoentschel , Thilo Scheiper
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Amerson Law Firm, PLLC
- Priority: DE102010064282 20101228
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/78 ; H01L29/66 ; H01L29/165

Abstract:
In sophisticated transistors, a specifically designed semiconductor material, such as a strain-inducing semiconductor material, may be sequentially provided in the drain region and the source region, thereby enabling a significant degree of lateral extension of the grown semiconductor materials without jeopardizing mechanical integrity of the transistor during the processing thereof. For example, semiconductor devices having different drain and source sides may be provided on the basis of sequentially provided embedded semiconductor materials.
Public/Granted literature
- US20120161204A1 Transistor Comprising an Embedded Sigma Shaped Sequentially Formed Semiconductor Alloy Public/Granted day:2012-06-28
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