Invention Grant
US08809156B1 Method for implementing deep trench enabled high current capable bipolar transistor for current switching and output driver applications
有权
用于实现用于电流开关和输出驱动器应用的深沟槽使能的大电流双极晶体管的方法
- Patent Title: Method for implementing deep trench enabled high current capable bipolar transistor for current switching and output driver applications
- Patent Title (中): 用于实现用于电流开关和输出驱动器应用的深沟槽使能的大电流双极晶体管的方法
-
Application No.: US13750374Application Date: 2013-01-25
-
Publication No.: US08809156B1Publication Date: 2014-08-19
- Inventor: David H. Allen , Douglas M. Dewanz , David P. Paulsen , John E. Sheets, II
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Joan Pennington
- Main IPC: H01L21/331
- IPC: H01L21/331

Abstract:
A method and structures are provided for implementing deep trench enabled high current capable bipolar transistor for current switching and output driver applications. A deep oxygen implant is provided in a selected region of substrate. A first deep trench and second deep trench are formed above the deep oxygen implant. The first deep trench is a generally large rectangular box deep trench of minimum width and the second deep trench is a second small area deep trench centered within the first rectangular box deep trench. Ion implantation at relatively high ion pressure and annealing is utilized to form highly doped N+ regions or P+ regions both inside and outside the outside the first deep trench and around the outside the second deep trench region. These regions provide the collector and emitter respectively, and the existing substrate region provides the base region between the collector and emitter regions.
Public/Granted literature
Information query
IPC分类: