Invention Grant
US08809165B2 Method for fusing a laser fuse and method for processing a wafer
有权
用于熔化激光熔丝的方法和用于处理晶片的方法
- Patent Title: Method for fusing a laser fuse and method for processing a wafer
- Patent Title (中): 用于熔化激光熔丝的方法和用于处理晶片的方法
-
Application No.: US13594946Application Date: 2012-08-27
-
Publication No.: US08809165B2Publication Date: 2014-08-19
- Inventor: Gunther Mackh , Gerhard Leschik
- Applicant: Gunther Mackh , Gerhard Leschik
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method for fusing a laser fuse in accordance with various embodiments may include: providing a semiconductor workpiece having a substrate region and at least one laser fuse; fusing the at least one laser fuse from a back side of the substrate region by means of an infrared laser beam.
Public/Granted literature
- US20140057412A1 METHOD FOR FUSING A LASER FUSE AND METHOD FOR PROCESSING A WAFER Public/Granted day:2014-02-27
Information query
IPC分类:
