Invention Grant
US08809182B2 Pad cushion structure and method of fabrication for Pb-free C4 integrated circuit chip joining
有权
无衬垫C4集成电路芯片接合的垫垫结构及其制造方法
- Patent Title: Pad cushion structure and method of fabrication for Pb-free C4 integrated circuit chip joining
- Patent Title (中): 无衬垫C4集成电路芯片接合的垫垫结构及其制造方法
-
Application No.: US12113230Application Date: 2008-05-01
-
Publication No.: US08809182B2Publication Date: 2014-08-19
- Inventor: Timothy H. Daubenspeck , Jeffrey P. Gambino , Christopher D. Muzzy , Wolfgang Sauter
- Applicant: Timothy H. Daubenspeck , Jeffrey P. Gambino , Christopher D. Muzzy , Wolfgang Sauter
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent David Cain
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A controlled collapse chip connection (C4) method and integrated circuit structure for lead (Pb)-free solder balls with stress relief to the underlying insulating layers of the integrated circuit chip by disposing soft thick insulating cushions beneath the solder balls and connecting the metallization of the integrated circuit out-of-contact of the cushions but within the pitch of the solder balls.
Public/Granted literature
- US20090273081A1 PAD CUSHION STRUCTURE AND METHOD OF FABRICATION FOR Pb-FREE C4 INTEGRATED CIRCUIT CHIP JOINING Public/Granted day:2009-11-05
Information query
IPC分类:
