Invention Grant
US08809457B2 Adhesive composition, adhesive film, and method for treating substrate
有权
粘合剂组合物，粘合剂膜和基材处理方法
- Patent Title: Adhesive composition, adhesive film, and method for treating substrate
- Patent Title (中): 粘合剂组合物，粘合剂膜和基材处理方法
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Application No.: US13628989Application Date: 2012-09-27
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Publication No.: US08809457B2Publication Date: 2014-08-19
- Inventor: Hirofumi Imai , Koki Tamura , Atsushi Kubo , Takahiro Yoshioka
- Applicant: Tokyo Ohka Kogyo Co., Ltd.
- Applicant Address: JP Kawasaki-Shi
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kawasaki-Shi
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: JP2011-218070 20110930; JP2012-062145 20120319
- Main IPC: C08L53/00
- IPC: C08L53/00 ; C09B67/00 ; C09J7/02 ; C09J153/02
Abstract:
An adhesive composition including a hydrocarbon resin, a modified elastomer that is bonded with at least one functional group-containing atom group, and a solvent.
Public/Granted literature
- US20130081760A1 ADHESIVE COMPOSITION, ADHESIVE FILM, AND METHOD FOR TREATING SUBSTRATE Public/Granted day:2013-04-04
Information query
