Invention Grant
US08809688B2 Polyamic acid solution, polyimide resin and flexible metal clad laminate using the same
有权
聚酰胺酸溶液，聚酰亚胺树脂和使用其的柔性金属覆层层压板
- Patent Title: Polyamic acid solution, polyimide resin and flexible metal clad laminate using the same
- Patent Title (中): 聚酰胺酸溶液，聚酰亚胺树脂和使用其的柔性金属覆层层压板
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Application No.: US13259858Application Date: 2010-04-02
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Publication No.: US08809688B2Publication Date: 2014-08-19
- Inventor: Yang Seob Kim , Won Kyum Kim , Hyung Wan Kim , Dong Bo Yang
- Applicant: Yang Seob Kim , Won Kyum Kim , Hyung Wan Kim , Dong Bo Yang
- Applicant Address: KR Seoul
- Assignee: Doosan Corporation
- Current Assignee: Doosan Corporation
- Current Assignee Address: KR Seoul
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2009-0029097 20090403
- International Application: PCT/KR2010/002048 WO 20100402
- International Announcement: WO2010/114338 WO 20101007
- Main IPC: H05K1/00
- IPC: H05K1/00
Abstract:
Disclosed are a polyamic acid solution, a polyimide resin prepared by imidization of the polyamic acid solution, a flexible metal clad laminate using the polyimide resin, and a printed circuit board including the flexible metal clad laminate, wherein the polyamic acid solution includes (a) 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride (BPDA), and pyromellitic dianhydride (PMDA) as aromatic tetracarboxylic acid dianhydride; (b) at least one aromatic diamine; (c) an organic solvent; and (d) an inorganic filler.
Public/Granted literature
- US20120085570A1 POLYAMIC ACID SOLUTION, POLYIMIDE RESIN AND FLEXIBLE METAL CLAD LAMINATE USING THE SAME Public/Granted day:2012-04-12
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