Invention Grant
- Patent Title: Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof
- Patent Title (中): 用于电路和多层电路的介电键层及其制造方法
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Application No.: US13040532Application Date: 2011-03-04
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Publication No.: US08809690B2Publication Date: 2014-08-19
- Inventor: Dirk M. Baars , Dale J. Doyle , Sankar J. Paul , Diana J. Williams , Carlos L. Barton
- Applicant: Dirk M. Baars , Dale J. Doyle , Sankar J. Paul , Diana J. Williams , Carlos L. Barton
- Applicant Address: US CT Rogers
- Assignee: Rogers Corporation
- Current Assignee: Rogers Corporation
- Current Assignee Address: US CT Rogers
- Agency: Cantor Colburn LLP
- Main IPC: H05K1/00
- IPC: H05K1/00
Abstract:
A bond ply, comprising a first outer layer comprising a thermosetting composition and a filler composition; a second outer layer comprising a thermosetting composition and a filler composition that is of the same type as that of the first outer layer; and an intermediate layer disposed between the first and the second outer layers, and comprising a thermosetting composition and a filler composition that is of the same type as the first and second outer layers, wherein the thermosetting composition of the intermediate layer has a degree of cure that is greater than a degree of cure for each of the thermosetting compositions of the first and the second outer layers.
Public/Granted literature
- US20110214906A1 DIELECTRIC BOND PLIES FOR CIRCUITS AND MULTILAYER CIRCUITS, AND METHODS OF MANUFACTURE THEREOF Public/Granted day:2011-09-08
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