Invention Grant
US08809691B2 Wired circuit board having first and second conductive patterns with respective connecting portions formed on first and second insulating layers
有权
有线电路板，具有形成在第一和第二绝缘层上的具有相应连接部分的第一和第二导电图案
- Patent Title: Wired circuit board having first and second conductive patterns with respective connecting portions formed on first and second insulating layers
- Patent Title (中): 有线电路板，具有形成在第一和第二绝缘层上的具有相应连接部分的第一和第二导电图案
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Application No.: US13554799Application Date: 2012-07-20
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Publication No.: US08809691B2Publication Date: 2014-08-19
- Inventor: Tetsuya Ohsawa
- Applicant: Tetsuya Ohsawa
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils PLLC
- Agent Jean C. Edwards
- Priority: JP2011-159688 20110721; JP2011-180971 20110822
- Main IPC: H05K1/03
- IPC: H05K1/03 ; G11B5/48 ; H05K1/05
Abstract:
A wired circuit board includes an insulating layer, and a conductive layer formed on the insulating layer. The insulating layer includes a first insulating layer, and a second insulating layer formed on the first insulating layer. The conductive layer includes a first conductive pattern, and a second conductive pattern. The first conductive pattern includes a first connecting portion formed on the first insulating layer and under the second insulating layer, and at least one pair of first terminals configured continuously to the first connecting portion so as to electrically connect to an external electronic element and spaced apart from each other to allow the electronic element to extend therebetween. The second conductive pattern includes a second connecting portion formed on the second insulating layer, and a second terminal configured continuously to the second connecting portion so as to electrically connect to a magnetic head provided on an external slider.
Public/Granted literature
- US20130020112A1 WIRED CIRCUIT BOARD Public/Granted day:2013-01-24
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