Invention Grant
- Patent Title: Three-dimensional circuit board
- Patent Title (中): 三维电路板
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Application No.: US13362970Application Date: 2012-01-31
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Publication No.: US08809693B2Publication Date: 2014-08-19
- Inventor: Daisuke Sakurai , Yoshihiko Yagi
- Applicant: Daisuke Sakurai , Yoshihiko Yagi
- Applicant Address: JP Kadoma-Shi, Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Kadoma-Shi, Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2006-005895 20060113; JP2006-025446 20060202; JP2006-025447 20060202
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H05K3/40 ; H05K3/46 ; H05K3/20 ; H05K3/00
Abstract:
A three-dimensional circuit board is formed by comprising a board, a first wiring-electrode group provided on a plurality of steps above the board, and a second wiring-electrode connected to the first wiring-electrode group at least in an altitude direction, in which at least a connecting portion between the first wiring-electrode group and the second wiring-electrode is integrated in a continuously identical shape.
Public/Granted literature
- US20120125676A1 THREE-DIMENSIONAL CIRCUIT BOARD AND ITS MANUFACTURING METHOD Public/Granted day:2012-05-24
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