Invention Grant
- Patent Title: Modular heater system
- Patent Title (中): 模块化加热器系统
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Application No.: US12351041Application Date: 2009-01-09
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Publication No.: US08809751B2Publication Date: 2014-08-19
- Inventor: Eric Ellis , Troy Ruben Bolton , Jacob Lindley
- Applicant: Eric Ellis , Troy Ruben Bolton , Jacob Lindley
- Applicant Address: US MO St. Louis
- Assignee: Watlow Electric Manufacturing Company
- Current Assignee: Watlow Electric Manufacturing Company
- Current Assignee Address: US MO St. Louis
- Agency: Brinks Gilson & Lione
- Main IPC: H05B3/44
- IPC: H05B3/44 ; F16L53/00

Abstract:
A heater system is provided that includes a hybrid insulation cover that has a first cover disposed around hinged carrier members and heat trace sections, and a second cover operatively engaged with the first cover and adapted for detachable placement around a heating target and its varying geometries. A flexible insulation jacket having a similar construction as the second cover is also provided for use with connector assemblies. Furthermore, a heater system is provided that includes at least one heat trace section encapsulated within adjacent insulating members for use with heating gaslines and pumplines of semiconductor processing systems.
Public/Granted literature
- US20090179022A1 MODULAR HEATER SYSTEM Public/Granted day:2009-07-16
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