Invention Grant
- Patent Title: Nonvolatile semiconductor memory device
- Patent Title (中): 非易失性半导体存储器件
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Application No.: US13847765Application Date: 2013-03-20
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Publication No.: US08809931B2Publication Date: 2014-08-19
- Inventor: Tsukasa Nakai , Nobutoshi Aoki , Takashi Izumida , Masaki Kondo , Toshiyuki Enda
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Holtz Holtz Goodman & Chick PC
- Priority: JP2012-066386 20120322
- Main IPC: H01L29/788
- IPC: H01L29/788

Abstract:
According to one embodiment, there is provided a nonvolatile semiconductor memory device including a substrate, a laminated film which has a configuration where first insulating layers and first electrode layers are alternately laminated in a first direction vertical to the substrate, a second insulating layer formed on an inner wall of a first through hole pierced in the first insulating layers and the first electrode layers along the first direction, an intermediate layer formed on a surface of the second insulating layer, a third insulating layer formed on a surface of the intermediate layer, and a pillar-like first semiconductor region which is formed on a surface of the third insulating layer and extends along the first direction.
Public/Granted literature
- US20130248965A1 NONVOLATILE SEMICONDUCTOR MEMORY DEVICE Public/Granted day:2013-09-26
Information query
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