Invention Grant
- Patent Title: Integrated circuits and methods of design and manufacture thereof
- Patent Title (中): 集成电路及其设计和制造方法
-
Application No.: US13296578Application Date: 2011-11-15
-
Publication No.: US08809958B2Publication Date: 2014-08-19
- Inventor: Henning Haffner , Manfred Eller , Richard Lindsay
- Applicant: Henning Haffner , Manfred Eller , Richard Lindsay
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L27/06
- IPC: H01L27/06

Abstract:
Integrated circuits and methods of manufacture and design thereof are disclosed. For example, a method of manufacturing includes using a first mask to pattern a gate material forming a plurality of first and second features. The first features form gate electrodes of the semiconductor devices, whereas the second features are dummy electrodes. Based on the location of these dummy electrodes, selected dummy electrodes are removed using a second mask. The use of the method provides greater flexibility in tailoring individual devices for different objectives.
Public/Granted literature
- US20120074499A1 Integrated Circuits and Methods of Design and Manufacture Thereof Public/Granted day:2012-03-29
Information query
IPC分类: