Invention Grant
- Patent Title: Package with passive devices and method of forming the same
- Patent Title (中): 无源器件封装及其形成方法
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Application No.: US13539149Application Date: 2012-06-29
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Publication No.: US08809996B2Publication Date: 2014-08-19
- Inventor: Shuo-Mao Chen , Der-Chyang Yeh , Li-Hsien Huang
- Applicant: Shuo-Mao Chen , Der-Chyang Yeh , Li-Hsien Huang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L29/00
- IPC: H01L29/00
Abstract:
An embodiment is a device comprising a substrate, a metal pad over the substrate, and a passivation layer comprising a portion over the metal pad. The device further comprises a metal pillar over and electrically coupled to the metal pad, and a passive device comprising a first portion at a same level as the metal pillar, wherein the first portion of the passive device is formed of a same material as the metal pillar.
Public/Granted literature
- US20140001635A1 Package with Passive Devices and Method of Forming the Same Public/Granted day:2014-01-02
Information query
IPC分类:
