Invention Grant
- Patent Title: E-fuse structures and methods of operating and manufacturing the same
- Patent Title (中): 电熔丝结构及其操作和制造方法
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Application No.: US13517788Application Date: 2012-06-14
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Publication No.: US08809997B2Publication Date: 2014-08-19
- Inventor: Yongsang Cho , Intaek Ku , Donghoon Kim , Ikhwan Kim , Choulhwan Oh
- Applicant: Yongsang Cho , Intaek Ku , Donghoon Kim , Ikhwan Kim , Choulhwan Oh
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2011-0059134 20110617
- Main IPC: H01L23/525
- IPC: H01L23/525

Abstract:
An e-fuse structure includes a first doped region and a second doped region formed in a substrate. The first doped region has a first conductivity type and the second doped region has a second conductivity type different from the first conductivity type. The first and second doped regions contact each other. A conductive pattern is disposed on the first and second doped regions and contacts the first and second doped regions. A first contact plug is disposed on the conductive pattern in an area corresponding to the first doped region, and a second contact plug is disposed on the conductive pattern in an area corresponding to the second doped region.
Public/Granted literature
- US20120319234A1 E-FUSE STRUCTURES AND METHODS OF OPERATING AND MANUFACTURING THE SAME Public/Granted day:2012-12-20
Information query
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