Invention Grant
- Patent Title: Integrated power converter package with die stacking
- Patent Title (中): 集成功率转换器封装,带芯片堆叠
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Application No.: US13890662Application Date: 2013-05-09
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Publication No.: US08810013B2Publication Date: 2014-08-19
- Inventor: Eric Yang , Jinghai Zhou , Hunt Hang Jiang
- Applicant: Eric Yang , Jinghai Zhou , Hunt Hang Jiang
- Applicant Address: US CA San Jose
- Assignee: Monolithic Power Systems, Inc.
- Current Assignee: Monolithic Power Systems, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Okamoto & Benedicto LLP
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/00 ; H01L25/065

Abstract:
An integrated circuit for implementing a switch-mode power converter is disclosed. The integrated circuit comprises at least a first semiconductor die having an electrically quiet surface, a second semiconductor die for controlling the operation of said first semiconductor die stacked on said first semiconductor die having said electrically quiet surface and a lead frame structure for supporting said first semiconductor die and electrically coupling said first and second semiconductor dies to external circuitry.
Public/Granted literature
- US20130292814A1 INTEGRATED POWER CONVERTER PACKAGE WITH DIE STACKING Public/Granted day:2013-11-07
Information query
IPC分类: