Invention Grant
- Patent Title: Semiconductor package including conductive member disposed between the heat dissipation member and the lead frame
- Patent Title (中): 半导体封装，包括设置在散热构件和引线框架之间的导电构件
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Application No.: US13761750Application Date: 2013-02-07
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Publication No.: US08810014B2Publication Date: 2014-08-19
- Inventor: Jae Hyun Lim , Chang Seob Hong , Young Hoon Kwak , Young Ho Sohn
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon, Gyunggi-Do
- Assignee: Samsung Electro-Mechanics, Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics, Co., Ltd.
- Current Assignee Address: KR Suwon, Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2012-0121315 20121030
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
There is provided a semiconductor package including: a lead frame having an electronic component mounted on one surface thereof; a heat dissipation substrate disposed downwardly of the lead frame; an insulating member disposed upwardly of the electronic component such that the electronic components are electrically connected to one another; a conductive member disposed between the insulating member and the lead frame and electrically connecting the electronic component to the lead frame; and a molded portion hermetically sealing the insulating member and the heat dissipation substrate.
Public/Granted literature
- US20140117522A1 SEMICONDUCTOR PACKAGE Public/Granted day:2014-05-01
Information query
IPC分类:
