Invention Grant
- Patent Title: Bond ring for a first and second substrate
- Patent Title (中): 用于第一和第二衬底的结合环
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Application No.: US12891062Application Date: 2010-09-27
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Publication No.: US08810027B2Publication Date: 2014-08-19
- Inventor: Chun-Wen Cheng , Hsueh-An Yang
- Applicant: Chun-Wen Cheng , Hsueh-An Yang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L21/30 ; H01L21/46
Abstract:
The present disclosure provides a device having a plurality of bonded substrates. The substrates are bonded by a first bond ring and a second bond ring. In an embodiment, the first bond ring is a eutectic bond and the second bond ring is at least one of an organic material and a eutectic bond. The second bond ring encircles the first bond ring. The first bond ring provides a hermetic region of the device. In a further embodiment, a plurality of wafers are bonded which include a third bond ring disposed at the periphery of the wafers.
Public/Granted literature
- US20120074554A1 BOND RING FOR A FIRST AND SECOND SUBSTRATE Public/Granted day:2012-03-29
Information query
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