Invention Grant
- Patent Title: Semiconductor device and wiring board
- Patent Title (中): 半导体器件和接线板
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Application No.: US13305679Application Date: 2011-11-28
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Publication No.: US08810038B2Publication Date: 2014-08-19
- Inventor: Takafumi Shimada , Atsushi Kikuchi
- Applicant: Takafumi Shimada , Atsushi Kikuchi
- Applicant Address: JP Yokohama
- Assignee: Fujitsu Semiconductor Limited
- Current Assignee: Fujitsu Semiconductor Limited
- Current Assignee Address: JP Yokohama
- Agency: Fujitsu Patent Center
- Priority: JP2011-012022 20110124
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H05K1/02 ; H01L23/66 ; H01L23/64 ; H01L23/00 ; H01L23/538 ; H01L23/50 ; H01L25/065 ; H01L25/16
Abstract:
A semiconductor device includes: a board; a power wire formed on the board; a signal wire formed on the board; a ground wire formed on the board; an insulating layer covering the signal wire, the power wire and the ground wire; and a metal film formed on the insulating layer, wherein a thickness of the insulating layer covering the power wire is different from a thickness of the insulating layer covering the signal wire, and the metal film is connected to a ground potential.
Public/Granted literature
- US20120187581A1 SEMICONDUCTOR DEVICE AND WIRING BOARD Public/Granted day:2012-07-26
Information query
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