Invention Grant
US08810048B2 3D IC and 3D CIS structure 有权
3D IC和3D CIS结构

3D IC and 3D CIS structure
Abstract:
An embodiment integrated circuit includes a first device supporting a first back end of line layer, the first back end of line layer including a first alignment marker, and a second device including a spin-on glass via and supporting a second back end of line layer, the second back end of line layer including a second alignment marker, the spin-on glass via permitting the second alignment marker to be aligned with the first alignment marker using ultraviolet light.
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