Invention Grant
- Patent Title: Acoustic wave device and method for fabricating the same
- Patent Title (中): 声波装置及其制造方法
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Application No.: US12781050Application Date: 2010-05-17
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Publication No.: US08810104B2Publication Date: 2014-08-19
- Inventor: Shunsuke Kido , Takeshi Nakao , Yasuharu Nakai , Kenji Nishiyama , Michio Kadota
- Applicant: Shunsuke Kido , Takeshi Nakao , Yasuharu Nakai , Kenji Nishiyama , Michio Kadota
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2006-056378 20060302
- Main IPC: H03H9/25
- IPC: H03H9/25

Abstract:
A surface acoustic wave device includes a piezoelectric substrate, at least one interdigital transducer (IDT) electrode provided on the piezoelectric substrate, and an insulator layer to improve a temperature characteristic arranged so as to cover the IDT electrode. When a surface of the insulator layer is classified into a first surface region under which the IDT electrode is positioned and a second surface region under which no IDT electrode is positioned, the surface of the insulator layer in at least one portion of the second surface region is higher than the surface of the insulator layer from the piezoelectric substrate in at least one portion of the first surface region by at least about 0.001λ, where the wavelength of an acoustic wave is λ.
Public/Granted literature
- US20100219911A1 ACOUSTIC WAVE DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2010-09-02
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