Invention Grant
- Patent Title: Acoustic wave device and method for manufacturing same
- Patent Title (中): 声波装置及其制造方法
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Application No.: US13131854Application Date: 2009-11-24
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Publication No.: US08810111B2Publication Date: 2014-08-19
- Inventor: Toru Fukano , Junya Nishii
- Applicant: Toru Fukano , Junya Nishii
- Applicant Address: JP Kyoto
- Assignee: Kyocera Corporation
- Current Assignee: Kyocera Corporation
- Current Assignee Address: JP Kyoto
- Agency: DLA Piper LLP (US)
- Priority: JP2008-304900 20081128
- International Application: PCT/JP2009/069802 WO 20091124
- International Announcement: WO2010/061821 WO 20100603
- Main IPC: H03H9/25
- IPC: H03H9/25 ; H01L41/09

Abstract:
An SAW device (1) has a piezoelectric substrate (3) propagating acoustic waves, and a comb-shaped electrode (6) arranged on a first surface (3a) of the piezoelectric substrate (3). The SAW device (1) has a columnar terminal (15) located on the first surface (3a) and electrically connected to the comb-shaped electrode (6), and a cover member (9) covering a side surface of the terminal (15). The terminal (15) comprises, in a first region in the direction of height thereof, a larger diameter on the side of the first surface (3a) compared with the diameter on the side opposite to the first surface (3a).
Public/Granted literature
- US20110234055A1 Acoustic Wave Device and Method for Manufacturing Same Public/Granted day:2011-09-29
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