Invention Grant
- Patent Title: Piezoelectric devices and methods for manufacturing piezoelectric substrates used in such devices
- Patent Title (中): 压电元件及其制造方法
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Application No.: US13274220Application Date: 2011-10-14
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Publication No.: US08810112B2Publication Date: 2014-08-19
- Inventor: Takehiro Takahashi
- Applicant: Takehiro Takahashi
- Applicant Address: JP Tokyo
- Assignee: Nihon Dempa Kogyo Co., Ltd.
- Current Assignee: Nihon Dempa Kogyo Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Klarquist Sparkman, LLP
- Priority: JP2010-235157 20101020
- Main IPC: H03H9/02
- IPC: H03H9/02

Abstract:
In a piezoelectric device, a piezoelectric substrate includes a vibrating piece with respective excitation electrodes on each principal surface thereof. The piezoelectric substrate is surrounded by an outer frame separated therefrom by a through-void except for a supporting portion connecting the vibrating piece to the frame. Extraction electrodes extend from the excitation electrodes across the supporting portion to the frame, and on edge surfaces of the supporting portion. The piezoelectric substrate is sandwiched between a lid and a package base to form a piezoelectric device. The outer surface of the package base is a mounting surface to which the extraction electrodes extend via an edge surface of the through-void in a region that does not overlap the excitation electrode.
Public/Granted literature
- US20120098390A1 PIEZOELECTRIC DEVICES AND METHODS FOR MANUFACTURING PIEZOELECTRIC SUBSTRATES USED IN SUCH DEVICES Public/Granted day:2012-04-26
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