Invention Grant
US08810321B2 Oscillator auto-trimming method and semiconductor device using the method
有权
振荡器自动修整方法和使用该方法的半导体器件
- Patent Title: Oscillator auto-trimming method and semiconductor device using the method
- Patent Title (中): 振荡器自动修整方法和使用该方法的半导体器件
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Application No.: US13611058Application Date: 2012-09-12
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Publication No.: US08810321B2Publication Date: 2014-08-19
- Inventor: Kwang Ho Choi
- Applicant: Kwang Ho Choi
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2012-0006383 20120119
- Main IPC: H03L7/085
- IPC: H03L7/085

Abstract:
An oscillator auto-trimming method is provided. The oscillator auto-trimming method includes receiving, by a subtractor, a first count result and second count result to output a difference between the first count result and the second count result as an offset frequency, receiving, by a divider, the offset frequency to output a divided signal corresponding to a result of dividing the offset frequency by a reference offset frequency output from a micro control unit, and receiving, by the micro control unit, the divided signal and determine whether to change an oscillator frequency.
Public/Granted literature
- US20130187722A1 OSCILLATOR AUTO-TRIMMING METHOD AND SEMICONDUCTOR DEVICE USING THE METHOD Public/Granted day:2013-07-25
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