Invention Grant
- Patent Title: Multiband coupling architecture
- Patent Title (中): 多频耦合架构
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Application No.: US13234041Application Date: 2011-09-15
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Publication No.: US08810333B2Publication Date: 2014-08-19
- Inventor: Claire Laporte , Hilal Ezzeddine
- Applicant: Claire Laporte , Hilal Ezzeddine
- Applicant Address: FR Tours
- Assignee: STMicroelectronics (Tours) SAS
- Current Assignee: STMicroelectronics (Tours) SAS
- Current Assignee Address: FR Tours
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: FR1057448 20100917
- Main IPC: H01P5/12
- IPC: H01P5/12 ; H03H7/38

Abstract:
A multiband coupling circuit including: a number of paths equal to the number of frequency bands, each path having a first terminal and a second terminal; a third terminal and a fourth terminal; a number of distributed couplers equal to the number of paths, all couplers being identical and sized according to the highest frequency band, and each coupler including a first conductive line between first and second ports connected to the first and second terminals of the concerned path, and a second conductive line coupled to the first one between third and fourth ports; a first set of attenuations between the third ports of the couplers and the third terminal of the circuit; and an array of filters between the fourth ports of the coupler and the fourth terminal of the circuit.
Public/Granted literature
- US20120122410A1 MULTIBAND COUPLING ARCHITECTURE Public/Granted day:2012-05-17
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